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Cushioning material for printed circuit board manufacturing - List of Manufacturers, Suppliers, Companies and Products

Cushioning material for printed circuit board manufacturing Product List

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Cushion material for printed circuit board manufacturing "ACE BOARD(R)"

Cushion material for printed circuit board manufacturing "ACE BOARD(R)"

Cushioning material for substrate manufacturing that combines high heat resistance and lasting cushioning properties.

"ACE BOARD(R)" is a high-performance heat-resistant cushioning material made of high-temperature resistant fibers. It is widely used in the production of printed circuit boards for smartphones and various other high-temperature pressing applications. 【Features】 ■ A wide range of options tailored to temperature ranges and required cushioning properties ■ Maintenance of cushioning properties: long life, reduction of waste ■ Non-gas: no generation of harmful gases *For more details, please download the PDF or contact us. Samples are also available.

  • Other polymer materials

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Cushion Material for Printed Circuit Board Manufacturing "ACE BOARD C Series"

Cushion Material for Printed Circuit Board Manufacturing "ACE BOARD C Series"

Recommended for CEM-1, CEM-3, and FR-1 substrates! Supports automatic transport via suction.

The "ACE BOARD C Series" is a cushioning material for printed circuit board manufacturing that can be used at a press temperature of 200°C. It possesses both cushioning and thermal conductivity properties, making it reusable. You can select an appropriate cushioning material. Please feel free to consult us when needed. 【Features】 ■ Combines cushioning and thermal conductivity properties ■ Usable at a press temperature of 200°C ■ Reusable ■ Compatible with automatic transport through adhesion *For more details, please refer to the PDF document or feel free to contact us.

  • fiber
  • Cushioning material

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Cushion material for printed circuit board manufacturing "ACE BOARD Z Series"

Cushion material for printed circuit board manufacturing "ACE BOARD Z Series"

The decomposition temperature of the structural fiber (PBO) is 650°C! Recommended for LCP and fluorine substrates, etc.

The "ACE BOARD Z Series" is a cushioning material for printed circuit board manufacturing that possesses both cushioning properties and thermal conductivity. It can be used at press temperatures of 300°C to 500°C or lower and is reusable. Additionally, the decomposition temperature of the constituent fiber (PBO) is 650°C. Please feel free to consult us when you need assistance. 【Features】 ■ Combines cushioning properties and thermal conductivity ■ Usable at press temperatures of 300°C to 500°C or lower ■ Reusable *For more details, please refer to the PDF document or feel free to contact us.

  • fiber
  • Cushioning material

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